Custom Silicon. Engineered for the Connected Future.

From advanced SoC design to AI-ready chips, we deliver secure, automotive-grade silicon solutions across the full chip development lifecycle.

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Silicon Engineering for the Next Era of Intelligent Devices

The demand for smarter, faster, and more connected devices is accelerating innovation in AI, IoT, 5G, automotive electrification, and HPC. HARMAN brings deep expertise across the entire chip development lifecycle—from defining system architecture and analog/digital design to rigorous mixed-signal validation and post-silicon integration.

With advanced EDA tools and proven methodologies, we enable our customers to confidently bring custom silicon solutions from concept to chip, ensuring performance, reliability, and seamless real-world application.

Our unique capabilities to create transformation

Optimized for Sub-7nm Performance & Efficiency

High-Density System-Level Integration

Built-In Resilience to Process Variability

Security-Embedded Silicon IPs

How we make it happen

HARMAN delivers end-to-end silicon design services—from RTL to GDSII—spanning SoC, FPGA, and IP prototyping. Our EDA expertise addresses miniaturization, power, performance, and cost. Using advanced verification and DFT strategies, we ensure accuracy, early bug detection, and high test coverage.

Comprehensive Chip Verification Across All Levels

We ensure design accuracy using simulation, emulation, and formal verification—critical for safety-first applications like automotive and other high-reliability systems.

Built-In Testability for Faster, Safer Silicon

We integrate scan chains, BIST, and boundary scan to enable early fault detection, reduce test time, and ensure reliable, cost-effective manufacturing.

Post-Silicon Validation for Real-World Reliability

We enable, validate, and debug silicon across platforms and nodes—ensuring end-to-end integration, performance, and system readiness using automation and AI-led testing.

Optimized RTL Design for Custom Applications

We craft efficient RTL designs using Verilog/VHDL, tailored for real-time, low-latency applications across automotive, IoT, and high-performance systems.

Efficient Physical Design for Performance & Scale

Our physical design team optimizes floorplans, placement, and routing to reduce chip area, power use, and delay—ensuring compact, high-performance silicon.

Timing Analysis to Ensure Speed & Stability

We use STA tools to verify and optimize timing paths, ensuring clock accuracy, frequency targets, and reliable chip performance across real-world conditions.

How we help

We provide services to support the migration or upgrading of legacy systems and applications. Keep up with the technology shift to AI and IoT with our solutions.

HARMAN RISC-V solutions

Product Engineering for mobile applications

Digital VPA services

Augmented and Virtual Reality

Embedded Systems Engineering

Wearable safety devices

Leader in Zinnov Zones™ 2024 for ER&D Services and Digital Engineering Services

Leader in Telecommunication and Semiconductor.

SUCCESS STORIES

Here's how our customers are reimagining what technology can do

Enhancing low-vision experiences with AR/VR devices

See how we helped create a sleek and versatile AR/VR headset with best-in-class features to help people with low-vision experience the world better.

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Best-in-class Silicon Validation for the World’s Largest Manufacturer

See how we enabled best-in-class Silicon Validation for the world’s largest semiconductor chip manufacturer. With exclusive ODC Labs to fast track and test case planning for platforms right from ordering to delivery.

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